Reactive sputtering chamber with gas distribution tubes

ABSTRACT

A sputtering apparatus for processing large area substrates is provided. By introducing gas across the entire target surface, a uniform composition film may be formed on the substrate. When the gas is introduced merely at the perimeter, the gas distribution is not uniform. By providing a gas introduction tube across the processing area, the reactive gas will uniformly distribute to the whole target. Also, providing the gas tube with multiple inner tubes provides a quick, effective gas dispersion capability.

BACKGROUND OF THE INVENTION

1. Field of the Invention

Embodiments of the present invention generally relate to a sputteringapparatus for forming films on large area substrate such as flat panel,large screen televisions, and solar panels.

2. Description of the Related Art

As demand for larger flat panel display screens increases, so must thesputtering target area. As the sputtering target become larger, itbecomes increasingly more difficult to adequately provide a uniformdistribution of reactive gas to the sputtering target. In the past,reactive gas has been introduced to the sputtering chamber through a gasinlet. The gas inlet is typically located on the side of the chamber.With an increase in target size, the reactive gas tends to notadequately reach the center of the target. When the reactive gas doesnot uniformly reach the entire target, the film deposited on thesubstrate will not have a uniform composition across the substrate. Fora large area sputtering targets with the gas introduced from theperiphery of the target, the gas concentration is highest at the chamberwall where the gas inlet is located. The gas concentration decreasesmoving across the chamber to a low point in the center of the chamber.

U.S. Pat. No. 5,346,601 to Barada et al. shows a sputtering apparatus inwhich two gas introduction tubes are provided within a collimator. Thegas introduction tubes are perpendicular to each other and within thesame plane. The gas tubes extend across the processing area. Byproviding the gas introduction tubes within the collimator, the reactivegas can adequately be provided to the substrate while not shadowing thewafer from sputtering material. A plurality of gas outlets are presentacross the tube. In order to remove the gas tubes, the entire collimatorstructure must be removed. The collimator cannot be removed without alsoremoving the gas tubes.

As shown by Barada et al., sometimes gas introduction tubes can extendacross the processing space between the target and the substrate. Thegas introduction tubes, such as that used by Barada et al., usually onlyintroduce gas through a series of gas outlet holes formed in a gasintroduction tube. A problem with prior art gas introduction tubes isthat they must provide the gas at a high pressure through the tube inorder to have a uniform pressure passing through the tiny holes in thetube. When the process is stopped and the gas is stopped, gas willcontinue to flow out of the holes because of the pressure buildup withinthe tube. The gas will continue to disperse into the processing chambereven after the process has stopped. The excess gas introduced into thechamber may contaminate the wafer or cause further, undesirablereactions with the substrate.

There is a need in the art to provide reactive sputtering gas to achamber uniformly across a large area sputtering target. There is also aneed in the art to provide easily removable reactive gas introductiontubes without disassembling the sputtering chamber.

SUMMARY OF THE INVENTION

The present invention generally involves a sputtering apparatus forforming films on large area substrates such as flat panel, large screentelevisions.

In a first embodiment, a sputtering apparatus has a vacuum chamber, asputtering target, a substrate support, and a plurality of parallel gasintroduction tubes. The gas introduction tubes extend across the vacuumchamber in an area between the target and the substrate support.

In a second embodiment, a sputtering apparatus has a vacuum chamber, asputtering target, a substrate support, and one or more gas introductiontubes extending across the vacuum chamber in an area between the targetand the substrate support. Each tube has at least one inner tube havinga plurality of openings and an outer tube having a plurality ofopenings. The outer tube surrounds the at least one inner tube.

In a third embodiment, a method of sputtering a sputtering target in asputtering apparatus comprises sputtering the target to deposit a layeron a substrate. The apparatus comprises a vacuum chamber, a sputteringtarget, and a plurality of gas introduction tubes extending across thevacuum chamber in an area between the target and the substrate whereinno collimator is present between the target and the substrate.

In a fourth embodiment, a method of sputtering a sputtering target in asputtering apparatus is provided that comprises sputtering the target todeposit a layer on the substrate. The sputtering apparatus comprises avacuum chamber, a sputtering target, and one or more gas introductiontubes extending across the vacuum chamber in an area between the targetand the substrate. Each tube comprises at least one inner tubecomprising a plurality of openings and an outer tube comprising aplurality of openings. The outer tube surrounds the at least one innertube.

In a fifth embodiment, a gas introduction tube is disclosed thatcomprises at least one inner tube comprising a plurality of openings andan outer tube comprising a plurality of openings. The outer tubesurrounds the at least one inner tube.

BRIEF DESCRIPTION OF THE DRAWINGS

So that the manner in which the above recited features of the presentinvention can be understood in detail, a more particular description ofthe invention, briefly summarized above, may be had by reference toembodiments, some of which are illustrated in the appended drawings. Itis to be noted, however, that the appended drawings illustrate onlytypical embodiments of this invention and are therefore not to beconsidered limiting of its scope, for the invention may admit to otherequally effective embodiments.

FIG. 1 is a side view of a gas introduction tube used in the instantinvention.

FIG. 2 is a sputtering apparatus according to the instant inventionshowing the spacing between the target, substrate, and gas introductiontubes.

FIGS. 3A-3D are cross sectional representations of gas introductionstubes.

FIG. 4 is an isometric view of a lower chamber assembly in an exemplaryphysical vapor deposition chamber.

FIG. 5 is an isometric cross-sectional view of gas introduction tubesformed in an exemplary physical vapor deposition chamber.

FIG. 6 is an isometric cross-sectional view of a lower chamber assemblyin an exemplary physical vapor deposition chamber according to thisinvention.

FIG. 7 is an isometric cross-sectional view of gas introduction tubesformed in an exemplary physical vapor deposition chamber according tothis invention.

DETAILED DESCRIPTION

The present invention generally provides an apparatus to introducereactive gas to a sputtering target apparatus. The sputtering apparatuscan be small enough to process semiconductor wafers or sufficientlylarge to process large area substrates used in making flat paneltelevision screens.

FIG. 2 is an exemplary schematic of a sputtering apparatus incorporatingthe instant invention. An exemplary sputtering apparatus which can bemodified to incorporate the instant invention is shown in U.S. patentapplication Ser. No. 11/247,705 filed Oct. 11, 2005 and herebyincorporated by reference in its entirety. The target 9 rests on abacking plate 8 within a vacuum chamber 7. The substrate 12 ispositioned in opposition to the target 9. The substrate 12 rests on apedestal 13. Between the target 9 and the pedestal 13, gas introductionstubes 14 are found. These tubes 14 extend across the chamber. As few asone and as many as necessary can be provided. If more than one tube 14is provided, the tubes 14 are substantially parallel to each other andin the same plane as each other. In one embodiment, the gas introductiontubes 14 are spaced about 100 mm to about 300 mm apart. In anotherembodiment, the gas introduction tubes 14 are spaced about 150 mm toabout 180 mm apart as shown by arrow E. The tubes 14 are located abouthalfway between the target 9 and the substrate 12, but the tubes 14should be greater than about 30 mm away from the substrate 12 andgreater than about 30 mm away from the target 9. If the gas tubes 14 arecloser than 30 mm to the target 9, the tubes 14 will likely disturb theplasma by sinking an excessive fraction of electrons from it and form alayer on the target 9. If the gas tubes 14 are closer than 30 mm to thesubstrate 12, then the gas tubes 14 will block material from evenlyreaching the substrate 12 so that a non-uniform film will be formed. Thetarget 9 and substrate 12 can be separated by about 300 mm to about 360mm. The target 9 would then be about 150 mm to about 180 mm from thetubes 14 as shown by arrow C. The substrate 12 would then be about 150mm to about 180 mm from the tubes 14 as shown by arrow D.

The gas tubes 14, while located between the target 9 and the substrate12, are not intended to provide any collimating effect. In fact, it ispreferable that the gas tubes 14 do not provide any collimating effect.No collimator should be present. A collimator will interfere with theuniform distribution of material on the substrate 12. Therefore, only asmany gas tubes 14 as are necessary to ensure a uniform gas distributionshould be present within the chamber. One or more gas tubes 14 could bepresent. The gas tubes 14 can run in a substantially 2-dimensional planeand could be parallel or substantially parallel. Alternatively, the gastubes 14 can intersect or even overlap.

By extending the gas introduction tubes 14 across the processing area,the reactive gas can be evenly provided to the target 9 for reaction.When the gas is provided at the periphery, the gas is not evenlydistributed to the target 9. When the gas is not evenly distributed, theresulting film will not be uniform in composition across the surface. Byproviding the reactive gas along the length of the target 9, thereactive gas will be uniformly provided to the target 9 and thedeposited film will have a uniform composition across its surface. It isespecially difficult to provide reactive gas uniformly to the target 9when the target 9 is a large area target 9 used for forming flat paneltelevision screens.

As noted above, the prior art gas introduction tubes will still emit gasinto the processing region even after the gas has been turned off andthe process stopped. The gas continues to flow into the processingregion because of the high pressure buildup within the gas introductiontube and the tiny holes through which the gas will pass. Simplyincreasing the hole size would certainly decrease the pressure and allowthe reactive gas to stop flowing upon shutdown, but more gas will leavethe tube at the hole closest to the edge than will leave at eachadditional hole along the gas tube. The larger holes will decrease thepressure and, thus, allow less gas to be introduced at the center of thetarget 9.

Because increasing the hole size will not solve the gas introductionproblem, another solution was found to maintain sufficient pressurewithin the tube to uniformly provide gas to the whole target surface andto also quickly reduce pressure within the tube at shutdown. FIG. 1shows an exemplary gas introduction tube according to the instantinvention. The gas introduction tube 3 contains numerous other tubeswithin the tube. For clarity, only three tubes are shown in the figure,but it is understood that as many tubes as are practically necessarycould be provided. The outer tube has a wall 4 with numerous holes alongits length. Within the outer tube is a middle tube that has a wall 5.The middle tube has numerous holes along its length as well. Within themiddle tube is an inner tube that has a wall 6 with numerous holes alongits length.

The gas introduction tube 3 provides a uniform gas pressure along thelength of the tube and quick dispersion of gas at shutdown. Gas flowsinto the tube 3 through the inner tube at a high pressure. The gaspasses through the tube 3 and passes through the wall 6 to the middletube. The gas in the middle tube is then dispersed through the wall 5 tothe outer tube. The gas in the outer tube is then dispersed through wall4 to the processing chamber. The holes in the walls of the tubes are notlined up. If the holes are lined up, then the gas would dispersedirectly from the inner tube to the chamber. Such a situation wouldrender the tube 3 exactly the same as the tube of the prior art ineffectiveness. By misaligning the holes, the gas must snake through theprocessing tubes and decrease in pressure as it passes through theholes. By providing the gas in the inner tube at a high pressure, thegas will snake through the middle tube and outer tube until it reachesthe processing chamber. Each time the gas passes through a hole toanother tube, the pressure will drop. When the gas is turned off, thepressure will rapidly drop within the tube and prevent unwanted gasintroduction.

FIGS. 3A-3D show cross sections of gas tubes 3A-3D. The gas tubes 3A-3Dcan be round (FIG. 3A), oval (FIG. 3B), square (FIG. 3C) or anyconventional shape. So long as the shape of the tubes does not interferewith sputtering target material, the shape of the gas introduction tubesis not restricted. FIG. 3D shows a circular gas instruction tube 3D thathas a plurality of holes F. The holes F are the outlets for the gas topass into the chamber. The holes F can face downward towards thesubstrate, upwards toward the target, or sideways away from both thetarget and the substrate. In one embodiment, the holes F face away fromthe target and the substrate. The holes F should be present on less thanabout 10% of the gas introduction tube 3D. In one embodiment, about 10to about 50 holes F can span the length of the tube. In anotherembodiment, about 25 to about 35 holes F can span the length of thetube. The size of the holes F should be much smaller than the diameterof the tubes. In one embodiment, the holes F are about 5 times smallerthan the diameter of the tube. In another embodiment, the holes F areabout 10 times smaller than the diameter of the tube. The diameter ofthe tubes can be about ⅛″ to about ⅞″. In another embodiment, thediameter of the tubes can be about ¼″ to about ¾″.

The gas introduction tubes 14 can have a bias applied to them. The biascan be applied to an individual tube 14 or collectively to all tubes 14.The tubes 14 can have an RF bias applied so that the gas introductiontubes 14 will function not only as a gas source, but also as anionization source. The gas tubes 14 could also have an AC, DC, or pulsedbias applied from a power source 2 or the tubes 14 can be grounded (seeFIG. 2). The gas introduction tubes could be used as an additionalsputtering target if desired. The gas tubes should be made of the samematerial as the sputtering target to prevent contamination.

The gas introduction tubes 14 can also be tailored to suit the needs ofthe user. For example, multiple tubes 14 can be used with each tube 14providing a different processing gas. Additionally, the instantinvention provides the added benefit of functionality. The tubes 14 canbe easily removed through the access port. By removing the tubes 14through the access ports, the entire chamber does not need to bedisassembled to simply change a few tubes 14. Benefits of such an easyremoval are clear. Downtime is significantly reduced.

In one embodiment of the process chamber 10, illustrated in FIG. 4, thelower chamber assembly 35 may contain one or more gas introduction tubes14. In one embodiment, each tube 14 extends through the processingregion 15. In this configuration the tubes 14 are in electrical contactwith the grounded shield 50, so that current flowing through the tubes14 passes through the shield 50 to ground. In another configuration, thetubes 14 are biased and not in contact with the shield 50. In oneembodiment, the tubes 14 are positioned over the stationary conductivemember support 97 and is used to hide or isolate the conductive membersupport 97 from the plasma generated in the processing region 15 (FIG.6). The ability to hide or isolate the conductive member 97 from theplasma will reduce the amount of deposition that will land on thestationary conductive member support 97 and thus minimize particlegeneration as the tubes 14 are removed from processing region 15 of theprocess chamber 10. In one embodiment, the tubes 14 are longer than thetarget surface in the dimension in the direction in which the tubes 14extend and thus the conductive member support(s) 97 are not positionedbelow the target surface so as to limit the interaction between theplasma generated in the processing region 15 and the conductive membersupport(s) 97.

In FIG. 4 the lid assembly has been removed, and is not shown, to moreclearly illustrate some of the components in the lower processingchamber assembly 35. In the embodiment shown in FIG. 4, the lowerchamber assembly 35 generally contains a substrate support assembly 60,chamber body assembly 40, a gas delivery system 14 and a shadow frame52. In one aspect, as shown in FIG. 4 the chamber body assembly 40generally contains a process kit holder 140, one or more chamber walls41 and a chamber base 42. The process kit holder 140 is positioned onthe chamber walls 41 and is adapted to support the shield 50, an uppershield 50E and one or more tubes 14 (e.g., three shown in FIG. 4). Inone aspect, the process kit holder 140 electrically connects the shield50 and the upper shield 50E to the chamber walls 41 which are grounded.The shield 50 and upper shield 50E are generally sized and adapted toprevent the plasma and sputtered target material from escaping from theprocess region 15 and depositing on the components in the lower chamberassembly 35. In the configuration illustrated in FIG. 4 the lowerchamber assembly 35 contains three tubes 14 that are positioned abovethe substrate support 61. In one aspect, as shown in FIG. 4, theconductive member support 97 is mounted on and electrically connected tothe grounded shield 50.

It should be noted that the cross-sectional area and the material usedto form the components in the tube 14, the conductive member 93, and theconductive member support 97 is important since it will affect theability to withstand the high temperatures that it will be seen duringprocessing (e.g., resistive heating and interaction with the plasma).The number of tubes 14 and the surface area of the conductive member 93exposed in the processing region 15 is important since it will have aneffect amount of current carried by each conductive member 93 and thusthe maximum temperature achieved by each conductive member 93 andconductive member support 97 during processing. The total surface areaof the conductive member 93 can be defined by the length of theconductive member 93 in the processing region times the length of theexposed perimeter of the conductive member 93 times the number ofconductive members positioned in the processing region. In one aspect,the number of gas tubes 14 positioned in the processing region 15 may bebetween about one and about twenty depending on the desired processuniformity, cost and complexity allowed for a desired application.Preferably, the number of gas tubes 14 that pass through the processingregion 15 is as few as possible with a preferred range of between abouttwo and about ten. The exposed perimeter of the embodiment of theconductive member 93 illustrated in FIG. 7 can generally be defined astwice the vertical length plus the horizontal length of surface of theconductive member 93. In one example, for a substrate that is 1800mm×1500 mm in size the exposed surface area of all of the conductivemembers 93 was about 5.0 m², which is spread across seven conductivemembers 93 that were 1.9 meters long. In one aspect, the cross-sectionalarea of the conductive member 93 is sized to carry the current deliveredto the conductive members 93 from the plasma generated by the targetbias. In one example, the total current that could be carried by all ofthe conductive members is about 1000 amps.

While FIGS. 4-7 illustrate embodiments of the tubes 14 that aregenerally straight and are generally rod or bar shaped, thisconfiguration is not intended to limit the scope of the inventiondescribed herein. In general, the term bar, or rod, shaped as usedherein is intended to described a component that is longer (e.g.,X-direction) than its cross-section is wide or high. In one aspect, thebar or rod shaped tubes 14 are not straight and thus have one or moreregions along their length that are curved or coiled. In one embodiment,the tubes 14 are positioned throughout the processing region to improvethe sputter deposited film uniformity on the substrate surface byincreasing the tube surface area and not appreciably obstructing oraltering the amount and/or direction of the flux of sputtered materialpassing from the target to the substrate surface. Referring to FIGS.3A-3D, in one embodiment, the cross-section of the tubes 14 are oval,round, rectangular, or other cross-sectional shape that will notappreciably obstruct or alter the amount and/or direction of the flux ofsputtered material passing from the target to the substrate surface.

FIG. 5 illustrates an exploded isometric view of a tube 14 that has aconductive member electrical connection point 105 that is adapted toelectrically contact a support electrical connection point 104 of thesupport 102. In one aspect, the conductive member electrical connectionpoint 105 and the support electrical connection point 104 act as a pivotpoint 106 that allows the tube 14 to be positioned in and/or removedfrom the processing region 15 (discussed below). To hide the pivot point106 a support cover 103 is positioned over this region to prevent thesputtered material deposition from inhibiting the removal of thesecomponents from the process region 15. The conductive member support 97may have a pivot point 106 at one end and an end that is detachable fromthe other vertical support.

In one embodiment, not shown, the tubes 14 are cantilevered over thesubstrate surface and thus do not extend all the way across thesubstrate. In one aspect, the cantilevered end of the tubes 14 may onlyextend to a point that is above the center of the substrate positionedon the substrate support. In one aspect, the cantilevered tubes 14 areevenly distributed throughout the processing region 15.

While the embodiments of the process chamber 10 illustrated herein allshow the tubes 14 in contact with the shield 50, this configuration isnot intended to be limiting to the scope of the invention describedherein. Therefore, in some embodiments the vertical support may bemounted on a bracket or supporting surface positioned in the chamberbody assembly 40.

Gas Tube Removal

FIG. 6 is an isometric cross-sectional exploded view as viewed fromoutside the process chamber 10 that illustrates the tubes 14 and plates99 in a position that is partially removed from the processing region 15of the process chamber 10. In one embodiment of the invention, the tubes14 are adapted to be removed from the process chamber 10 through anaccess port 98 formed in the process kit holder 140. In one aspect, theaccess port 98 may be formed in the chamber wall 41. In FIG. 6, the lidassembly has been removed to more clearly illustrate some of thecomponents in the lower processing chamber assembly 35. The tube 14 hasa handle 93A that is attached or welded to the surface of the gasintroduction tubes 14 to facilitate the insertion and/or removal of thegas introduction tubes 14 through the access port 98 formed in theprocess kit holder 140.

When the tube 14 has reached its useable lifetime, the tube 14 can beremoved from the processing region 15 by venting the process chamber 10and removing a plate 99 that is sealably attached to the process kitholder 140 so that a user can access the tube 14 through the access port98. The process of removing the tube 14 may include shutting “off” thevacuum pumps (not shown) and then delivering a flow of an inert gas,such as argon, into the vacuum processing area from the tubes 14 tocreate a pressure greater than atmospheric pressure in the vacuumprocessing area. Creating a positive pressure in the processing areaduring the removal of the tube 14 may be advantageous since it canprevent the contamination of the chamber components positioned in theprocessing region 15 due to the exposure of the process kit componentsto atmospheric contamination (e.g., atmospheric gases, vapors orparticles). In one aspect, the access ports 98 are purposely kept assmall as possible to minimize the area through which atmosphericcontamination can enter the processing region 15. The down time of theprocessing chamber 10 can thus be minimized since there is no need toremove and reposition the chamber lid assembly 20 and/or other majorchamber components, there is no need to bake out of the chamber toremove adsorbed gases and water from processing chamber components, andthere is no need to replace contaminated components due to theirexposure to atmospheric contamination.

Gas Introduction Tube Bias

In one embodiment of the process chamber 10, a biasable shield 50F maybe positioned in the processing region to change the electric field andthe plasma density generated near the edge of the target and substrate.FIG. 7 illustrates one embodiment of the biasable shield 50F that ispositioned around the periphery of the substrate 12 and is electricallyconnected to the shield 50, which is grounded, by use of an electricalcomponent 50G. In one aspect, the electrical component 50G may be usedas a “stand-off” to physically space the biasable shield 50F from theshield 50. It should be noted that the term “grounded” is generallyintended to describe a direct or in-direct electrical connection betweena component and the anode. The biasable shield 50F may be purposelybiased at a different potential versus the tube surfaces due to theintroduction of the electrical component 50G that may add resistive,capacitive and/or inductive type elements to the electrical path betweenthe biasable shield 50F and the tube surfaces. In one aspect, duringprocessing a bias voltage, which will generally be less anodic, may be“passively” induced in the biasable shield 50F due to a bias appliedbetween the target and anodic surface (e.g., shield 50) and theinteraction of the biasable shield 50F with the plasma generated in theprocessing region. In another aspect, not shown, the biasable shield 50Fmay be separately biased by use of a power supply (not shown) which isin electrical communication with the biasable shield 50F and the anodesurfaces. In this configuration the electrical component 50G may act asan insulator.

In another embodiment of the processing chamber 10, the tubes 14 may bepurposely biased at a different potential versus the anode surfaces bythe introduction of a resistive, capacitive and/or inductive componentsto the electrical path between the tubes 14 and the anode surfaces. Inone embodiment, as shown in FIG. 7, a second electrical component 50Hmay be positioned in the electrical path between the tube 14 and theshield 50 to allow the tube 14 to be biased at a different potentialthan the shield 50. In one aspect, during processing a bias voltage,which will generally be less anodic, may be “passively” induced in thetube 14 due to a bias applied between the target and anodic surface(e.g., shield 50) and the interaction of the tube 14 with the plasmagenerated in the processing region. In another aspect, the tube 14 maybe separately biased by use of a power supply (see FIG. 2) which is inelectrical communication with the tubes 14. In this configuration thesecond electrical component 50H may act as an insulator.

While the foregoing is directed to embodiments of the present invention,other and further embodiments of the invention may be devised withoutdeparting from the basic scope thereof, and the scope thereof isdetermined by the claims that follow.

1. A sputtering apparatus for processing a substrate, comprising: avacuum chamber; a sputtering target mounted in the vacuum chamber; apedestal positioned in the vacuum chamber to support the substrate; anda plurality of gas introduction tubes extending across said vacuumchamber in an area between said target and said pedestal wherein nocollimator is present between said target and said pedestal.
 2. Thesputtering apparatus as claimed in claim 1, wherein each said tubecomprises: at least one inner tube comprising a plurality of openings;and an outer tube comprising a plurality of openings, said outer tubesurrounding said at least one inner tube; wherein said openings of saidouter tube do not line up with said openings of said at least one innertube.
 3. The sputtering apparatus as claimed in claim 1, wherein eachsaid tube is grounded.
 4. The sputtering apparatus as claimed in claim1, wherein each said tube is biased.
 5. The sputtering apparatus asclaimed in claim 1, wherein each said tube is spaced greater than about30 mm from said pedestal and greater than about 30 mm from said target.6. A sputtering apparatus for processing a substrate, comprising: avacuum chamber; a sputtering target; a pedestal positioned in the vacuumchamber to support the substrate; and one or more gas introduction tubesextending across said vacuum chamber in an area between said target andsaid pedestal, each said tube comprising: at least one inner tubecomprising a plurality of openings; and an outer tube comprising aplurality of openings, said outer tube surrounding said at least oneinner tube.
 7. The sputtering apparatus as claimed in claim 6, whereineach said gas introduction tube is grounded.
 8. The sputtering apparatusas claimed in claim 6, wherein each said gas introduction tube isbiased.
 9. The sputtering apparatus as claimed in claim 6, wherein eachsaid gas introduction tube is spaced greater than about 30 mm from saidpedestal and greater than about 30 mm from said target.
 10. Thesputtering apparatus as claimed in claim 6, wherein said openings ofsaid outer tube do not line up with said openings of said at least oneinner tube.
 11. A method of sputtering a sputtering target in asputtering apparatus that comprises a vacuum chamber, a sputteringtarget, and a plurality of gas introduction tubes extending across saidvacuum chamber in an area between said target and said substrate whereinno collimator is present between said target and said substrate, saidmethod comprising: sputtering said target to deposit a layer on asubstrate while providing gas from said tubes.
 12. The method as claimedin claim 11, wherein each said tube comprises: at least one inner tubecomprising a plurality of openings; and an outer tube comprising aplurality of openings, said outer tube surrounding said at least oneinner tube; wherein said openings of said outer tube do not line up withsaid openings of said at least one inner tube.
 13. The method as claimedin claim 11, wherein each said tube is grounded.
 14. The method asclaimed in claim 11, wherein each said tube is biased.
 15. The method asclaimed in claim 11, wherein each said tube is spaced greater than about30 mm from said substrate and greater than about 30 mm from said target.16. A method of sputtering a sputtering target in a sputtering apparatusthat comprises a vacuum chamber, a sputtering target, and one or moregas introduction tubes extending across said vacuum chamber in an areabetween said target and said substrate, each said tube comprises atleast one inner tube comprising a plurality of openings and an outertube comprising a plurality of openings, said outer tube surroundingsaid at least one inner tube, said method comprising: sputtering saidtarget to deposit a layer on a substrate while providing gas from saidone or more gas introduction tubes.
 17. The method as claimed in claim16, wherein each said gas introduction tube is grounded.
 18. The methodas claimed in claim 16, wherein each said gas introduction tube isbiased.
 19. The method as claimed in claim 16, wherein each said gasintroduction tube is spaced greater than about 30 mm from said substrateand greater than about 30 mm from said target.
 20. The method as claimedin claim 16, wherein said openings of said outer tube do not line upwith said openings of said at least one inner tube.
 21. A gasintroduction tube comprising: at least one inner tube comprising aplurality of openings; and an outer tube comprising a plurality ofopenings, said outer tube surrounding said at least one inner tube. 22.The gas introduction tube as claimed in claim 21, wherein said openingsof said outer tube do not line up with said openings of said at leastone inner tube.
 23. The gas introduction tube as claimed in claim 21,wherein said tube is grounded.
 24. The gas introduction tube as claimedin claim 21, wherein said tube is biased.